China polishing material industry market development status in 2019
Release time:
2023-03-02 11:05
Source:
According to buck information released by the China CMP polishing materials market research and investment strategy report (2019 edition) ", according to CMP (chemical mechanical polishing (ChemicalMechanicalPolishing) technology is one of the key process in semiconductor manufacturing process, using the "soft grinding hard" principle of wear, and play with a softer material for polishing to achieve the high quality of surface polishing. Through the comprehensive action of chemical and mechanical, the surface damage caused by mechanical polishing and the slow polishing speed, poor surface flatness and polishing consistency easily caused by chemical polishing are avoided.
With the continuous progress of IC chip process technology, the integration level of chips has been continuously improved, which makes the wafer manufacturing requirements on the surface flatness of silicon wafers continue to improve, so the demand for CMP process continues to increase. For example, silicon wafers needed for deep submicron DRAM require 3-6 CMP cycles, and deep submicron MPU require 9-13 CMP cycles. According to data, the global market size of CMP polishing materials reached us $1.59 billion in 2015 and us $1.72 billion in 2017.
At present, the polishing pad is mainly monopolized by dow chemical company, with a market share of about 90%. Other suppliers include toray of Japan, 3M, tri-party chemical of Taiwan, Cabot and other companies, with a total share of about 10%. Polishing fluid, the main suppliers include Japan Fujimi, HinomotoKenmazai, the United States Cabot, dupont, Rodel, Eka, South Korea ACE and other companies, occupying more than 90% of the global market share, the domestic market mainly rely on imports.
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Sichuan Leshan Rich Fortune Metallurgical Co., Lid
Add：Xinhua Village, Zhugen Town, Wutongqiao County, Leshan City, Sichuan Province
